The Smart Jar™ Sputtering System
The Super Series Smart Jar™
The Smart Jar Sputtering System pictured above was designed to co-sputter up to three materials simultaneously.
- Compact minimal floor space requirement for lower cost of ownership
- Cathode positions with flexible orientation, up, down, side or angled for uniformity and film growth control
- Codeposition for new materials development or research
- Multiple power supplies RF, DC, Pulsed DC tailored to film deposition requirements
- Concurrent dual side deposition for production applications
- Substrate heat to 1100°C and etch and bias for cleaner substrates and denser more homogenous films
- Electropolished chamber, with in situ heater and high speed pumping for lower cleaner partial pressure
- Up stream/down stream gas control for more repeatable reactive films
- Load Lock to reduce contaminate introduction and provide purer films
- Batch or single substrate capacities designed to fit your requirement
- Flexible user friendly software tailored to meet your needs
The Super Series Smart Jar™ Sputtering System
With over 40 years of experience, TM Vacuum Products offer innovative solutions for any thin film deposition requirement. The Super Series Smart Jar™ sputtering system is suitable for both research and small lot production requirements. The core sputtering system has a 26″ diameter chamber, but you can specify your chamber to be any size, as small as 18″ to as large as 48″. Smart Jars™ are delivered configured to meet the intended application, however should the situation change, cathode configuration, orientation, deposition mode, deposition angle as well as source to substrate distance can all be altered in the field with minimal or no factory involvement. The Smart Jar™ sputtering system is designed to meet your needs both now and in the future.
Features and Options of Smart Jar™ Sputtering System
The Smart Jar Sputtering System above is currently in production at a United States Government Research Facility.
- Chamber size: Diameters from 18-48″, electro-polished SS
- Chamber cooling: Double wall full water jacket standard
- Pumping: Cryopump standard, Turbomolecular pump and LN2 trap available
- Base Vacuum: Below 3 X10-7 Torr standard
- Fixturing: Rotating table standard, custom fixturing available
- Deposition: Modes Magnetron Sputtering, evaporation, ion beam sputtering or laser ablation alone or in combination available
- Cathodes: Circular or rectangular, diode or magnetron – size, quantity, and orientation are application and/or chamber size specific
- Cathode Power: RF, DC or Pulsed DC available
- Substrates: Single or batch-consult factory for capacities
- Load lock: Optional with either roughing vacuum or high vacuum capabilities
- Chamber heat: Chamber bake optional
- Substrate heat: Temperatures to 1100°C available
- Etch and bias: RF etch/bias or DC bias available
- Controls: Dedicated PLC with manual override and dedicated process sequence standard. Full computer control with data logging available
