The Smart Box™ System for Sputtering
The Super Series Smart Box™
Four target side sputtering system.
- Production-proven cathodes with flexible orientation, up, down, side or angled to meet your needs
- Co-deposition available for compound material formation
- Multiple power supplies RF, DC, Pulsed DC tailored to your production requirements
- Concurrent dual-side deposition available for increased throughput
- Substrate etch to promote excellent film adhesion and better contact resistance
- Substrate heat to 400°C and bias for cleaner substrates and denser more homogenous films
- Electro-polished chamber, with in-situ heater and high speed pumping to rapidly attain lower cleaner partial pressure
- Up stream/down stream gas control for more repeatable reactive films
- Flexible fixturing or pallets to meet your substrate requirements
- Flexible user friendly software tailored to meet your needs
The Super Series Smart Box™ for Sputtering
With over 40 years of experience TM VacuumProducts can fulfill almost any thin film deposition requirement. The Super Series Smart Box™ is designed to meet today’s batch thin film production requirements. With chamber sizes from as small as 32″ to as large as 80″, a Smart Box™ can provide an economical solution to your specific production requirement. The Smart Box™ is delivered configured to meet the intended application, however modifications to the source to substrate distance and cathode orientation can be made in the field with minimal factory assistance. The Smart Box™ is designed to meet your sputtering needs both now and in the future.
Features and Options
- Chamber size: Diameters from 32-80″, electro-polished SS
- Chamber cooling: Double-wall, full water jacket standard
- Pumping: Cryopump standard Turbomolecular pump or diffusion pump and LN2 trap or cryogenic water pump available
- Base vacuum: Below 3 X10 -7 Torr standard
- Fixturing: Rotating table or drum standard, custom fixturing available
- Deposition modes: Magnetron Sputtering, evaporation, ion beam sputtering or laser ablation alone or in combination available
- Cathodes: Circular or rectangular, diode or magnetron – size, quantity, and orientation (up, down or side) are application and/or chamber size specific
- Cathode power: RF, DC or Pulsed DC available
- Substrates: Capacity system and substrate dependent consult factory
- Chamber heat: Chamber bake-out option available
- Substrate heat: Front side or back side to 400°C available
- Etch and bias: RF etch/bias or DC bias available
- Controls: Full computer control with graphic interface with data logging and redundant manual controls
