The Smart Jar ™ Sputtering System

The Super Series Smart Jar.™

The Super series Smart Jar™ is a flexible vacuum system platform that can be ordered configured for either sputtering or evaporation depending on the user’s specific requirements. With chamber diameters available from as small as 18" to as large as 48" a Smart Jar™ sputtering system can be configured to meet your needs no matter how unique they are. Some of the benefits that are available with the sputter configuration for the Smart Jar™ are:

• Compact minimal floor space requirement for lower cost of ownership
• Cathode positions with flexible orientation, up, down, side or angled for uniformity and film growth control
• Codeposition for new materials development or research
• Multiple power supplies RF, DC, Pulsed DC tailored to film deposition requirements
• Concurrent dual side deposition for production applications
• Substrate heat to 1100°C and etch and bias for cleaner substrates and denser more homogenous films
• Electropolished chamber, with in situ heater and high speed pumping for lower cleaner partial pressure
• Up stream/down stream gas control for more repeatable reactive films
• Load Lock to reduce contaminate introduction and provide purer films
• Batch or single substrate capacities designed to fit your requirement
• Flexible user friendly software tailored to meet your needs
  

The Super Series Smart Jar ™ Sputtering System.

With over 40 years of experience, TM Vacuum Products offer innovative solutions for any thin film deposition requirement. The Super Series Smart Jar™ sputtering system is suitable for both research and small lot production requirements. The core sputtering system has a 26" diameter chamber, but you can specify your chamber to be any size, as small as 18" to as large as 48". Smart Jars™
are delivered configured to meet the intended application, however should the situation change, cathode configuration, orientation, deposition mode, deposition angle as well as source to substrate distance can all be altered in the field with minimal or no factory involvement. The Smart Jar™ sputtering system is designed to meet your needs both now and in the future.

Features and Options of Smart Jar™ Sputtering System

Chamber size Diameters from 18-48", electro-polished SS
Chamber cooling Double wall full water jacket standard
Pumping Cryopump standard, Turbomolecular pump and LN2 trap available
Base Vacuum Below 3 X10^-7 Torr standard
Fixturing Rotating table standard, custom fixturing available
Deposition Modes Magnetron Sputtering, evaporation, ion beam sputtering or laser ablation alone or in combination available
Cathodes Circular or rectangular, diode or magnetron - size, quantity, and orientation are application and/or chamber size specific
Cathode Power RF, DC or Pulsed DC available
Substrates Single or batch-consult factory for capacities
Load lock Optional with either roughing vacuum or high vacuum capabilities
Chamber heat Chamber bake optional
Substrate heat Temperatures to 1100°C available
Etch and bias RF etch/bias or DC bias available
Controls Dedicated PLC with manual override and dedicated process sequence standard. Full computer control with data logging available