The Endeavor 24™ thin film deposition system is the latest release from T-M Vacuum Products in thin film technology, taking full advantage of today’s most advanced thin film deposition principals. The Endeavor 24™ is a universally dynamic tool, which can be configured to operate with either thermal evaporation or sputter deposition principles.
The Endeavor 24™ is a flexible vacuum system platform that can be ordered configured for magnetron/diode sputtering or electron beam/resistive evaporation depending on the user’s specific requirements. The Endeavor 24™ will accept a variety of deposition assist hardware including but not limited to an ion source, substrate rotation, thin film control, RF/DC Etch/ Bias, heat and gas partial pressure control.
The Endeavor 24™ Sputtering System pictured above was designed to co-sputter con-focally up to four (4) different materials, either simultaneously or individually in sequence.
Optional chamber sizes from as small as 18″ to as large as 48″ are available as a custom system design, enabling the Endeavor series to fit your specific film deposition and substrate geometry requirements.
General Features and Benefits of the Endeavor 24™ Thin Film Deposition System are:
- Compact foot print for better utilization of clean room space
- 304L Stainless Steel process chamber, pumping system and internal tooling
- Modular powder coated frame assembly with ease of access to all internal components
- T-M Intelligent™ HMI computer/process logic control system
- Low voltage control for safety and a noise free (EMF) environment
- Cryogenic or turbo-molecular high vacuum pumping capabilities
- Electro-polished process chamber, pumping system and internal tooling for better high speed pumping
- Accurate upstream/downstream gas control for more repeatable reactive film processing
- Automatic or manual Load Lock systems to reduce contamination and provide for a purer film environment
- Batch or single substrate capabilities designed to fit your requirement
- Flexible user friendly software tailored to meet your specific process needs
Thin Film features and benefits available with the Endeavor 24™ sputtering configuration are:
- Cathode positions with flexible orientation, up, down, side or angled, for uniformity and film growth control
- Cathode source shutter, and table shutter control
- Sequential and/or co-deposition materials development within a research or production environment
- Multiple as well as different types of power supplies RF, DC and DC-Pulsed, tailored to your film deposition requirements
- Optional Ion Source for ion etch, cleaning and IAD applications
- Concurrent dual side deposition for production applications
- Standard and optional substrate rotation systems for flat and three dimensional geometries
- Substrate heat up to 1100°C along with etch and bias for cleaner substrates and denser more homogenous films
- Upstream/downstream gas control for more repeatable reactive film processing
- Batch or single substrate capabilities designed to fit your requirement
- Flexible user friendly recipe management software tailored to meet your needs
Thin Film features and benefits available with the Endeavor 24™ Electron Beam / Thermal evaporation configuration are:
- Single large crucible or multi-pocket crucible electron beam source capability
- Sequential and/or co-deposition materials development within a research or production environment
- Electron beam power supplies up to 10 KVA with automatic sweep control
- Single or multi-pocket resistive thermal boat or crucible source capability
- Thermal resistive power supplies up to 5 KVA with automatic voltage selection control
- Electron beam or thermal source shutter capabilities and control
- Optional thin film rate, thickness (quartz crystal) monitoring and control
- Optional Ion source for ion etch cleaning and IAD applications, for cleaner substrates and denser more homogenous films
- Optional optical film (transmission/reflection) monitoring and wave length cut-off control
- Concurrent dual sided deposition for production applications
- Standard and optional substrate rotation systems for flat and three dimensional geometries
- Dome style rotation capabilities for lift-off and other emerging film processing
- Planetary or dome substrate heating to 500°C
- Upstream/downstream gas control for more repeatable reactive film processing
- Batch or single substrate capabilities designed to fit your requirement
- Flexible user friendly recipe management software tailored to meet your needs
With 50 years of experience, TM Vacuum Products offers innovative solutions for any thin film deposition requirement. The Endeavor 24™ sputtering system is suitable for both research and small lot production requirements.
Endeavor 24™ is delivered configured to meet the intended application, however should the situation change, cathode configuration, orientation, deposition mode, deposition angle as well as source to substrate distance can all be altered in the field with minimal or no factory involvement. The Endeavor 24™ sputtering system is designed to meet your needs both now and in the future.
